Double sided grinding/polishing machine

编号:YM-20.5BY-T/YM-20.5BP-T
Double sided grinding/polishing machine
Description
1、 Overview of Machine Usage
This machine is widely used for precision double-sided grinding/polishing of large-sized wafers, piezoelectric crystals, compound semiconductors, silicon crystals, optical glass, and other hard and brittle materials.
This machine uses a 20 inch planetary wheel carrier,φ Each 300mm wafer can produce 5 pieces,φ Each 200mm wafer can produce 15 pieces.
 
2、 Machine Structure Description
This machine has undergone significant improvements in stability and performance based on customer usage requirements and operator habits. The crossbeam of the upper grinding disc is a gantry structure, which enhances the rigidity and stability of the entire machine.
The rise, fall, slow rise, and slow fall of the grinding disc are controlled by a single handle, making the operation simple and convenient.
The upper and lower drive gears adopt helical gears with a gear accuracy of GB-6HK, and the material is made of 45 # steel high-frequency quenching. Ensuring stability, wear resistance, as well as the rigidity and operational accuracy of the overall transmission of the machine.
The whole machine is driven by three motors, and the sun gear has a wider range of speed changes. It can control the working speed ratio arbitrarily and meet the requirements of different grinding processes The variable frequency motor is equipped with a frequency converter to implement soft start and soft stop, which enables smooth speed regulation and shutdown, and has the advantages of low impact.
The internal gear ring is lifted and lowered by a trapezoidal screw driven by a servo motor and a reducer, with smooth lifting and no shaking. The gear ring is lifted and lowered using a jog method, which can control the height of the gear ring and ensure uniform wear throughout its entire length, extending its service life.
In addition to double-sided grinding and polishing, this device can also process single-sided polishing of 2.5D or 3D curved surfaces.
The electrical system is controlled by PLC, and the PT human-machine interface displays various operating parameters of the equipment. The pressure is controlled by an electrical proportional valve, combined with precision pressure sensors for more accurate control of the weight and pressure of the grinding disc
The whole machine adopts automatic timed lubrication, which improves the service life of the whole machine.
All internal components are equipped with hard toothed gear variable frequency reducers, which improve the service life of accessories
The grinding fluid tank adopts double-layer cooling, reducing the adverse effects and defects caused by high temperature on the product






3、 Main technical parameters



 
Serial Number
project
parameter
one
Upper and lower grinding/polishing disc specifications
Φ 1380*Φ 432*50
two
Star Wheel Specifications
Modulus m=3 division circleΠ 510 teeth, z=170
three
Number of planetary gears placed
3≤n≤ five
four
Maximum size for grinding/polishing workpieces
Φ 460 (diagonal dimension of rectangular workpiece)
five
Grinding/polishing workpiece thickness
0.3-35mm
six
Ring gear lifting height
0-50mm
seven
Lower grinding disc speed
0-50rpm
eight
Upstream grinding disc speed
0-36rpm
nine
Sun gear speed
0-24rpm
ten
Lower plate motor reducer
K87-11KW
eleven
Upper plate motor reducer
K77-7.5KW
twelve
Sun gear motor reducer
RV090-2.2KW
thirteen
Main cylinder
SAI200-400S
fourteen
Rated power of machine tool
Approximately 23KW in total
fifteen
supply voltage
Three phase five wire AC380v
seventeen
Gas source pressure
0.5-0.6mpa
eighteen
Equipment dimensions
2300mm*1800mm*2780mm
nineteen
equipment quality
≈ 7000KG
 
4、 Basic installation requirements

 
4.1.  Equipment specifications and dimensions (length×); Width× Height: 2300mm * 1800mm * 2780mm

4.2.  Equipment weight:& 7000kg

4.3.  Equipment power: 23KW

4.4.  Power requirements:

Rated power supply voltage: three-phase 380V/50HZ;         Rated current:& 35A

Wire system: Three phase five wire system

Other: Reliable grounding must be ensured and kept away from interference sources such as welding machines.

4.5.  Compressed air source requirements:

Pressure: 0.6 MPa;            

Interface: Nylon tracheaΦ 10

Other: Effective drying equipment must be installed in the gas source section

4.6. Clear water source requirements:

Pressure: above 0.25MPa

Interface: PVC fiber braided hose 19 * 22mm

4.7. Requirements for sewage outlets:

Interface: PVC steel wire hoseΦ 75

4.8. Cooling water requirements:

Pressure: 0.6MPA;         Temperature: 17 ℃~18 ℃;      

Interface: PVC steel wire hoseΦ 19





 
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Contact Us

Telephone:0755-23421559 / 0755-23421557

Email:spr@sz-spr.com

Shenzhen Factory Address:1st Floor, No. 21 Xinpitou Cattle Farm, Xinqiang Community, Xinhu Street, Guangming District, Shenzhen (Xinjing Science and Technology Park)

Anhui Factory Address:No. 168 Dongyi Road, Tongcheng Economic Development Zone, Anqing City, Anhui Province