Wafer chamfering machine

1、 Equipment Introduction Explanation

1.1 This equipment is mainly suitable for 6-inch to 8-inch wafer chamfering machines, using fully automatic robotic arms for automatic loading and unloading;

1.2 The main components of the equipment are made of marble and castings. The castings are subjected to heat treatment to eliminate stress and ensure the stability and accuracy of the equipment.

1.3 The key components of the machine tool, including the guide rails, are imported precision grade to ensure high precision of the machine tool. Featuring high-strength guidance and smooth motion, suitable for high-speed machining: The machine tool adopts imported grinding grade screw rods with high transmission accuracy, ensuring long-term mechanical errors.

1.4 The motion drive adopts a high-precision servo system.

1.5 Adopting the Japanese Keyence high-precision grating measuring instrument with automatic centering to ensure machining accuracy.

1.6 Professional triple waterproof structure design ensures that the screw guide rail is not contaminated even in the harshest working conditions.



2、 Equipment Security Configuration Instructions

2.1 Equipped with a contact type safety door switch, the equipment cannot be started until the safety door is closed, ensuring the safety of operators.

2.2. The electrical box door is equipped with a contact type safety door. When the electrical box is opened for maintenance, the equipment automatically shuts off.

2.3. Full cover waterproof design.

2.4.   Before starting up, it is necessary to check and confirm whether the cooling system and lubrication system supply are working properly.

2.5. It is strictly prohibited to open the door and touch any internal components with your hands while the equipment is rotating to avoid accidental injury.

2.6. Pay attention to regularly cleaning the debris inside the machine to ensure the normal operation of the equipment.

2.7. It is prohibited to place anything other than processed products on the equipment workbench that may affect the normal operation of the equipment.

2.8   During the operation of the equipment, it is prohibited to lean or lie on the equipment to avoid injury.

2.9   Before processing, it is necessary to correctly define the coordinates of each axis, and immediately redefine the starting and ending points of the Z-axis after replacing consumables.

2.10 When running the program on the device, manual mode should be used first to ensure that the program and coordinates are normal.



3、 Main specification parameters

 
Serial Number
project
parameter
one
Maximum wafer processing size
8 inches
two
Minimum wafer processing size
6 inches
three
Wafer material box
4 of them
four
Four axis travel
x-axis
eight hundred and forty
Y-axis
one hundred and eighty
Z-axis
forty
C-axis
360º
five
principal axis
power
12KW
Maximum speed
24000rpm
rated torque
14.2（Nm）
voltage
380V
six
Fastest air travel movement
12000mm
seven
Maximum feed rate
0mm
eight
XYZ axis positioning accuracy
0.008mm/300mm
nine
XYZ axis repeat positioning accuracy
0.004mm/300mm
ten
Center positioning detection accuracy
0.004mm/360º
eleven
Thickness detection accuracy
0.008mm
twelve
vacuum pressure
-0.05~-0.07Kpa
thirteen
air pressure
0.5~0.6MPa
fourteen
Supply Voltage
AC380V 50HZ
fifteen
Machine power
15KW
sixteen
Machine weight
About 2500kg
seventeen
External dimensions
2000x1400x2200mm (allowable error 100mm)
               





























































3、 Equipment Accuracy Parameter Table



 
Equipment Accuracy Parameter Table
Serial Number
content
standard
one
Straightness of X-axis axis motion
&Le; 0.01/full stroke
two
Linearity of Y-axis axis motion
&Le; 0.01/full stroke
three
Straightness of Z-axis axis motion
&Le; 0.01/full stroke
four
Verticality between X-axis axis motion and Y-axis axis motion
≤0.02
five
Verticality between Z-axis axis motion and X-axis axis motion
≤0.02
six
Verticality between Z-axis axis motion and Y-axis axis motion
≤0.02
seven
The perpendicularity between the spindle axis and the X-axis axis movement
&Le; 0.02 (diameter 300)
eight
The perpendicularity between the spindle axis and the Y-axis axis movement
&Le; 0.02 (diameter 300)
nine
Radial runout of spindle taper hole
/≤0.01
ten
X/Y/Z axis positioning accuracy
≤0.008
eleven
X/Y/Z axis repeat positioning accuracy
≤0.004
twelve
True roundness detection
≤0.015


























 
 
 
 
 




4、 Equipment installation instructions