What is the pressing process of a sapphire substrate lapping machine

Because the tension rod bolts fracture, frequent replacement of the flange bolts, the uneven surface of the tension bar, press head hydraulic plate surface grinding machine of the sapphire substrate is not smooth, so that the pressure in the process, the force of bolt is not uniform enough, at the same time also produced by bending the bolt, fastening bolt force not uniform, bolt force is easy to fracture during operation. Therefore, the connection flange should be replaced in time when the flanges are not smooth, and the hardness and strength of the material are relatively high. When tightening bolts, the use of the hydraulic wrench should be correct. The tightening order of stretching rod bolts should be carried out in three times. First press to 540bar, second times to 720bar, third times to 960bar, and not to press at once. The compound function mold polishing machine refers to the combination of ultrasonic polishing and other common mold processing technology, that is, the composite ultrasonic mold polishing machine, and it is an essential and convenient tool for the die surface treatment practitioners.


The size of the sapphire substrate grinder is the same size as the mill. The device disk speed can reach 60RMP, diameter 310mm, thickness of about 15mm, fixed wheel diameter 410mm, diameter 360mm, equipped with three fixed wheels at the same time; the processing size must be less than 333mm, this is more than the data type; motor power: 7.5KW, 380V, 3; the 200kg 3 cylinder pressure. A cylinder