Sapphire substrate processing
The sapphire substrate chamfering process:
Water belongs to the substrate by “ &rdquo parts, sections; around after the sapphire substrate is an acute angle in the follow-up process easily due to the stress concentration caused by defective products. So it is necessary to wafer edge trimming arc shape, improve the mechanical strength of the edge of the sheet, avoid the stress concentration caused by defects.
For the chamfering process, it is the characteristic of this process that how to process out the standard parts quickly and easily.
Wafer chamfering machine in “ &ldquo application: chamfer;
The wafer chamfering machine is a equipment specially designed for the processing of sapphire substrate.
The machining accuracy of the machine tool is high and the roundness can be guaranteed to be less than 0.01mm. At the same time, it has low cost of consumables and the processing efficiency is much higher than that of foreign imported equipment. And in a number of domestic enterprises in the process of use, has gradually replaced the foreign equipment.
The expansion conditions of the wafer chamfering machine are large, and the equipment can be processed after replacing the appliance with the actual sapphire, for example: the cell phone lens, the camera and so on.
Support the process of carving machine:
To guide customers to produce professional tooling, material selection, reasonable distribution of airway
To help customers select the vacuum pump, gas tank and other
Assist customers in layout of gas pipes, in order to meet the requirements of
Guide customers to choose the suitable coolant, control the ratio of
Help customers design grinder according to the characteristics of the product.
2.2. precision double-sided grinding machine:
The sapphire substrate polishing process:
The grinding process of sapphire substrate is one of the core processes in the substrate substrate process, which basically determines the final quality of the substrate substrate. In order to remove the chip cutting damage layer and improve the flatness of the wafer, the wafer needs to make coarse and fine grinding on the double-sided grinding machine. The coarse grind is made of spheroidal graphite cast iron to make grinding disc, because its abrasive content is good. The grinding capacity should be 18 ~ 20μ m.
Precision double-sided grinding machine in &ldquo grinding; ” application:
Can be used for double-sided grinding machine of sapphire substrate mainly includes: 9.5B, 13.6B and 16.5B
9.5B because the machine is small, with less, currently in use have rarely. The industry mainly uses 13.6B or 16.5B double side lapping machine for grinding process.
B double-sided grinding machine is specially designed for ultra-thin, precision parts grinding and processing. With its long run of low fault, precision and stability, and get the customer's affirmation.
Support precision double-sided polishing machine technology:
Guide the customer to make design special tour star wheel.
Assist customers in layout of gas pipes, in order to meet the requirements of
Guide customers to choose the suitable grinding fluid;
Help the customer to make the appropriate production process.
2.3. precision polishing machine (special):
The sapphire substrate polishing process:
The polishing process of sapphire substrate is one of the core processes of substrate substrate process, which improves wafer roughness and makes the surface achieve the accuracy of epitaxial wafer epitaxy. In order to make the chip meet the standard thickness, roughness and warpage, the wafer needs to be polished by a double-sided polishing machine. The double-sided polishing process is usually polished with a polishing skin and a diamond liquid. The amount of polishing is about 8 to 10μ m.
The precise double sided polishing machine in “ polishing ” application:
The double-sided polishing machine for polishing sapphire substrate is 16.5B.
Sapphire double sided polishing process has a long working time and the equipment needs long-term pressure operation. Therefore, the long-term stability and long-term operation of the sapphire will bring high temperature, which requires a lot of equipment design.
The 16.5B special machine adopts the B machine tool structure. Its structural stability is recognized in the industry. The upper and lower grinding surface is specially designed to increase the automatic cooling system of the upper and lower plates, which can minimize the temperature rise of the equipment and ensure the accuracy and stability of the products.
Support precision double-sided polishing machine technology:
Guide the customer to make design special tour star wheel.
Assist customers in layout of gas pipes, in order to meet the requirements of
Guide customers to choose the suitable polishing liquid;
Help the customer to make the appropriate production process.