Semiconductor large-size silicon wafer edge precision polishing machine

编号:EP300B
Semiconductor large-size silicon wafer edge precision polishing machine
Description
1、 Equipment Introduction Explanation



1.1  This equipment is mainly suitable for 8-inch to 12 inch wafer edge polishing machines, using fully automatic robotic arms for automatic loading and unloading;

1.2 The main components of the equipment adopt a reasonable frame welding structure. After the whole machine is welded, stress is eliminated through heat treatment technology to ensure the stability and non deformation of the body, thereby ensuring the accuracy of the equipment.

1.3 The key components of the machine tool, including the guide rails, are imported precision grade to ensure high precision of the machine tool. Featuring high-strength guidance and smooth motion, suitable for high-speed machining: The machine tool adopts imported grinding grade screw rods with high transmission accuracy, ensuring long-term mechanical errors.

1.4 The motion drive adopts a high-precision servo system.

1.5 Adopting the Japanese Keyence high-precision grating measuring instrument with automatic centering to ensure machining accuracy.

1.6 Professional triple waterproof structure design ensures that the screw guide rail is not contaminated even in the harshest working conditions.



2、 Equipment Security Configuration Instructions



2.1  Equipped with a contact type safety door switch, the equipment cannot be started without the safety door closed, ensuring the safety of operators.

2.2  The electrical box door is equipped with a contact type safety door. When the electrical box is opened for maintenance, the equipment automatically shuts off.

2.3  Fully covered waterproof design.

2.4  Before starting up, it is necessary to check and confirm whether the cooling system and lubrication system supply are working properly.

2.5  It is strictly prohibited to open the door and touch any internal components with your hands while the equipment is rotating to avoid accidental injury.

2.6  Pay attention to regularly cleaning the debris inside the machine to ensure its normal operation.

2.7  It is prohibited to place anything other than processed products on the equipment workbench that may affect the normal operation of the equipment
2.8  During the operation of the equipment, it is prohibited to lean or lie on the equipment to avoid injury.

2.9  Before processing, it is necessary to correctly define the coordinates of each axis, and immediately redefine the starting and ending points of the Z-axis after replacing consumables.

2.10 When running the program on the device, manual mode should be used first to ensure that the program and coordinates are normal.



3、 Main specification parameters

 
Serial Number
project
parameter
one
Material handling robot X-axis
2000mm
two
Y-axis of material handling robot
500mm
three
Material handling robot Z-axis
300mm
four
Material handling robot C-axis
± 350º
five
Platform handling manipulator X-axis
700mm
six
Platform handling manipulator Y-axis
1700mm
seven
Testing station
Elevating Z-axis
60mm
Rotate C-axis
± 360º
Detecting host
Keyence
Repetitive positioning accuracy
0.004mm
eight
TOP workstation
Elevating Z-axis
200mm
Rotate C-axis
360º
Repetitive positioning accuracy
0.008mm
Maximum speed of polishing wheel
3000rpm/min
nine
CF-A surface workstation
Elevating Z-axis
200mm
Rotate C-axis
360º
repeatability
0.008mm
Maximum speed of polishing wheel
3000rpm/min
ten
CF-B surface workstation
Elevating Z-axis
200mm
Rotate C-axis
360º
repeatability
0.008mm
Maximum speed of polishing wheel
3000rpm/min
eleven
V-notch
Y-axis
100mm
C-axis
± 18º
Maximum speed of polishing wheel
6000rpm/min
twelve
Cleaning station
C-axis
360º
repeatability
0.008mm
discharge
3³ /H
lift
5M
thirteen
Quantity of material boxes
4 pcs
fourteen
Box capacity
25 pcs
fifteen
vacuum pressure
-0.05~-0.07Kpa
sixteen
air pressure
0.5~0.6MPa
seventeen
Supply voltage
AC380V 50HZ
eighteen
Machine power
22KW
nineteen
Machine weight
About 4000kg
twenty
External dimensions
3550x2400x2050mm (allowable error 100mm)
 
4、 Equipment Accuracy Parameter Table
 
Equipment Accuracy Parameter Table
Serial Number
content
standard
one
Straightness of X-axis axis motion
&Le; 0.01/full stroke
two
Linearity of Y-axis axis motion
&Le; 0.01/full stroke
three
Straightness of Z-axis axis motion
&Le; 0.01/full stroke
four
Verticality between X-axis axis motion and Y-axis axis motion
≤0.02
five
Verticality between Z-axis axis motion and X-axis axis motion
≤0.02
six
Verticality between Z-axis axis motion and Y-axis axis motion
≤0.02
seven
The perpendicularity between the spindle axis and the X-axis axis movement
&Le; 0.02 (diameter 300)
eight
The perpendicularity between the spindle axis and the Y-axis axis movement
&Le; 0.02 (diameter 300)
nine
Radial runout of spindle taper hole
/≤0.01
ten
X/Y/Z axis positioning accuracy
≤0.008
eleven
X/Y/Z axis repeat positioning accuracy
≤0.004
twelve
True roundness detection
≤0.015




 
5、 Equipment installation instructions
   

 
Pay attention to me
Follow WeChat official account
Follow WeChat official account
Contact Us

Telephone:0755-23421559 / 0755-23421557

Email:spr@sz-spr.com

Shenzhen Factory Address:1st Floor, No. 21 Xinpitou Cattle Farm, Xinqiang Community, Xinhu Street, Guangming District, Shenzhen (Xinjing Science and Technology Park)

Anhui Factory Address:No. 168 Dongyi Road, Tongcheng Economic Development Zone, Anqing City, Anhui Province